The typically used moulding process is based on the film-insert-molding technology, which is also known as in-mould-labelling (IML) technology. Preformed, carrier films, which could have decorative and/or electronic functions, are joined with a polymer matrix in an injection moulding process and therefore becomes an integral part of the final product. Overmoulding, backmoulding or a combination of these processes can be used.
The polymers could be e.g. thermoplastics (polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polybutylene terephthalate (PBT), …) or multi-component, reactive compounds (e.g. polyamide (PA), Polyurethane (PU), …). The different polymer options open up a wide range of corresponding processing parameters like e.g. pressure and temperature. This is important for a proper processing of sensitive film inserts.